Automatic wafer probing of photonic integrated circuits with thermal tuning and permanent trimming functions

Abstract:
The development of silicon photonic circuits brings new challenges in quality assurance and testing, such as characterizing and measuring large quantities of photonic components on a wafer. Here we report about a custom wafer prober for photonic integrated circuits with thermal tuning and permanent trimming functions. Probing experiments were successfully performed with spectral transmission measurements of crystalline and amorphous silicon photonic components. Active thermal tuning of microring resonances were verified and tested with integrated heaters using an electrical probe card whereas permanent modifications were achieved with a trim laser at visible wavelength.