Integration of LTCC into Printed Circuit Boards for Trustworthy Electronics
Conference: MikroSystemTechnik Kongress 2023 - Kongress
10/23/2023 - 10/25/2023 at Dresden, Deutschland
Proceedings: MikroSystemTechnik Kongress 2023
Pages: 4Language: englishTyp: PDF
Authors:
Schroeter, Annett; Krieger, Uwe (VIA electronic GmbH, Hermsdorf, Germany)
Lehnberger, Christoph (ANDUS ELECTRONIC GmbH, Berlin, Germany)
Uhlig, Peter (IMST GmbH, Kamp-Lintfort, Germany)
Goldberg, Adrian (Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Dresden, Germany)
Abstract:
Sustainable and trustworthy applications gaining significance in electronics, a fast-growing industry itself. The integration of well-established robust materials, like low temperature cofired ceramics (LTCC), into printed circuit boards (PCB) can prolong lifetimes, enhance safety, and improve properties of the assemblies, e.g. RF applications. Thus, new safety elements are designed within the context of the project VE-CeraTrust.