Cu sintering for high power electronics packaging – challenges and solutions

Abstract:
Copper sintering can form interconnection as reliable as silver ones if not better. Oxidation is the source of the challenges in terms of sintering, but a combination of controlled atmosphere and reducing solvents/binders are the focus on the production of a reliable material. Different copper pastes have already been produced and are in the advanced stages of testing. They don’t require a change of the machinery used in the state of the art for sintering and they would be a significantly cheaper option than silver.