Patterning and CTE-matching of contacts to optimize thermomechanical stress in power semiconductor pre-packages

Conference: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
03/15/2022 - 03/17/2022 at Berlin, Germany

Proceedings: ETG-Fb. 165: CIPS 2022

Pages: 7Language: englishTyp: PDF

Authors:
Pavlicek, Niko; Liu, Chunlei; Stalder, Patrick; Salvatore, Giovanni; Mohn, Fabian (Hitachi Energy Research, Baden-Dättwil, Switzerland)
Huesgen, Till (University of Applied Science Kempten, Germany)
Thomas, Tina (Fraunhofer IZM, Berlin, Germany)

Abstract:
Embedding power semiconductor devices in pre-packages may enable low-inductive power semiconductor module designs with superior thermal performance and reliability. However, it is crucial to understand mechanical stress formation due to the differences in thermal expansion of the materials used. This paper presents a systematic study of thermomechanical stresses in Si and SiC power semiconductor pre-packages based on PCB embedding or compression molding. The analysis is based on thermomechanical FEM simulations and complemented by passive thermal cycling of different test carrier designs. Patterning and CTE-matching of contacts are proven as strategies to minimize thermomechanical stress.