Silver-free thick film copper bonding for highly reliable metal ceramic substrates

Abstract:
Heraeus Electronics’ silver-free Thick Film Copper Bonding (TFCB(r)) technology addresses the cost-performance gap between the active metal brazed (AMB) Si3N4 based metal ceramic substrates (MCS) suitable for high-end applications and the cost-efficient direct copper bonded (DCB) Al2O3 substrates suitable for applications with lower requirements. The cost reduction of the TFCB(r) process is achieved by using a silver-free brazing technology combined with an efficient brazing process. Within this report we will demonstrate the performance of our TFCB(r) substrates as a result of application related tests showing thermal-, isolation-partial discharge performance and robustness in thermal shock testing.