Advanced cooling concept based on standard power modules significantly improves lifetime

Abstract:
An advanced cooling concept is presented here that is entirely based on standard power modules with well-known mechanical and electrical properties. A ribbon-bond structure on the back side of the power module significantly improves the thermal performance on an open, liquid-cooled heat sink, without altering other parts of the power module. Significantly lower chip temperatures are measured using the proposed solution, with a reduction of 25 K being reached in one application. A lifetime estimation using the rainflow method with a standardized mission profile shows an improvement by a factor of two to almost six, compared to a standard module on a closed heat sink. The advanced cooling concept thus gives a chance to significantly increase lifetime without altering other parts of the power module.