Two-layered planar SiC power module for industrial applications

Abstract:
Within the frame of the PENTA funded project CosmoDU a highly integrated motor and its power electronics for driving industrial applications in the 10kW region are developed. The required high compactness of the power-electronic part is achieved by using wide-bandgap SiC semiconductors and new packaging approaches. In this paper a novel planar packaging technology based on a two-layer build-up is described. The manufacturing of first prototypes and the different process steps are described in detail. Finally, the resulting power modules are tested in terms of leakage current and MOSFETs output characteristic.