End-of-life mechanism due to cyclic thermomechanical loading of power modules with .XT joining technology

Abstract:
Further investigation results from power-cycling (PC) tests with Infineon .XT PrimePACK(TM) power modules and low cycle times reveal a significant change in the running time until end of life (EOL) as well as a predominant aging mechanism compared to power modules with standard joining technology. While the standard technology shows a Vce increase caused by a bond-wire detachment as the most prominent EOL mechanism, the .XT reaches EOL via Rth increase, mostly due to a degradation of the underlying substrate-to-base-plate solder layer (substrate solder).