Nanotechnology meets temperature-sensitive devices

Abstract:
In its properties as a low-temperature technology the reactive bonding technology has been successfully implemented in the field of MOEMS applications for the first time. CiS Research Institute developed a high performance lighting unit (muHBS), and has been able to transfer the innovative reactive bonding technology from the laboratories of the research institute into production. Within the micro-optical system variant, the challenge was to add the assembly technology of a temperature sensitiv laser emitter (chip). Due to the IRMS a solution was developed which allowed a connection of the sensitive laser emitter in flip-chip technology.