Comparison of Thermal Measurement Methods and Determination of Thermal Resistance of Die Attach Materials used in Power Electronic Modules

Abstract:
Thermal performance of power electronics is one key factor in reliability and costs of power packages. Simulation of the thermal performance during the design of power devices is mandatory to create a reliable and cost effective system. Reliable and relevant material data are the basis for robust simulation results. This paper will compare different thermal measurement methods with the focus on die attach materials. Some measure the specific thermal conductivity on a bulk measurement value. Others methods are determining the thermal performance of packages assembled with different die attach materials. The tests results will be discussed by their interdependency.