Integrated High-Temperature Isolation barrier with Coreless Transformer

Abstract:
A novel coreless technology based on an existing process but initially designed to produce integrated passive components for commercial temperatures, is used and its capability at 200 C is tested. Design aspects and electrical characterizations of the samples are presented. An endurance test, realized with a full modulation and demodulation prototype board, shows a satisfactory behaviour at high temperatures. Finally, a dynamic isolation test checks the coreless transformer behaviour against dV/dt perturbation. This work targets a high-temperature inverter application with high-frequency switching frequency and based on multi-chip module.