Evaluation of electrochemical migration into an isolated sintered power module
Conference: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
03/08/2016 - 03/10/2016 at Nürnberg, Deutschland
Proceedings: CIPS 2016
Pages: 5Language: englishTyp: PDF
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Authors:
Cosiansi, Fernando; Candido, Pirri Fabrizio (Politecnico di Torino, Torino, Italy)
Mattiuzzo, Emilio; Turnaturi, Marcello (VISHAY Semiconductor Italiana S.P.A, Borgaro Torinese, Italy)
Abstract:
The introduction of the silver sintering process into high power electronics noticeably improved the characteristics and reliability of power modules. However, the solder layer substitution with a pure Ag sintered layer increases the risk of obtaining metal migration. As a consequence, this paper evaluates the possibility of generating and avoiding ECM - Electrochemical Migration when sintered silver is implemented as a die attach, compared to a standard solder layer SnAg(3.5).