An Overview of Advanced Power Semiconductor Packaging for Automotive System
Conference: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
03/08/2016 - 03/10/2016 at Nürnberg, Deutschland
Proceedings: CIPS 2016
Pages: 6Language: englishTyp: PDF
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Authors:
Wang, Yangang; Dai, Xiaoping; Li, Daohui; Jones, Steve (Power Semiconductor R&D Centre, Zhuzhou Times Electric co. Ltd, Lincoln, UK)
Liu, Guoyou (Power Semiconductor R&D Centre, Zhuzhou Times Electric co. Ltd, Zhuzhou, China)
Abstract:
As one of the highest requirement application sectors of power semiconductors, Hybrid and Electric Vehicles (HEV/EV) power electronics system challenges the packaging technologies in performance, temperature, reliability, cost, weight and volume etc. Power IGBT modules are crucial component affecting the above issues, therefore its packaging has been investigated comprehensively. Two aspects of investigation have been carried out in order to produce superior power modules for HEV/EV. One is development of advanced power chip that improve power density, operation temperature, efficiency and frequency etc. The other is innovation and optimization of module packaging which provide effective thermal management, robust interconnections and mechanical support, high reliability, compact and cost effective product.