1D-Nanostructures for 3D-Packaging

Abstract:
In this work we present strategies and relevant results of our strategies to incorporate one-dimensionally elongated nanomaterials into the processes of electronic packaging. In particular, we aim at new material-based approaches to exploit the high potential of these materials within vertical packaging. On one hand, we present the application of wellknown structures of carbon nanotubes (CNTs) as enhancing additive inside the copper filling of through-silicon vias (TSVs) with the aim to handle throwing-back problems such as mismatch in thermal expansion or weak mechanical/electrical properties of copper. A second approach consists of the fabrication and application of an interconnecting film that contains a high density of anisotropically oriented metallic nanowires (NWs) inside a dielectric matrix. This film is expected to once enable an easier packaging process and better interconnect properties besides suitability to future geometric demands.