ECOC 2009
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Challenges of Si Photonics for on-chip Integration

Conference: ECOC 2009 - 35th European Conference on Optical Communication
09/20/2009 - 09/24/2009 at Vienna, Austria

Proceedings: ECOC 2009

Pages: 3Language: englishTyp: PDF

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Authors:
Wada, K. (Department of Materials Engineering, The University of Tokyo, Japan)

Abstract:
To clear fundamental limits of electrical interconnection, WDM optical interconnection should be implemented in Si photonics. Challenging issues are strongly connected with temperatures in CMOS processing and in operation. We will report a solution of Ge backend processing and a proposal to avoid temperature fluctuation of light wavelengths.