Cover IEC 62418:2010
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IEC 62418:2010

Semiconductor devices - Metallization stress void test

Circulation Date: 2010-04
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 34 VDE Artno.: 217127

Content

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.