Cover IEC 60749-16:2003
größer

IEC 60749-16:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Circulation Date: 2003-01
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 13 VDE Artno.: 210451

Content

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).